▶Membrane/pProbe is the exclusive partner of FormFactor Inc. in China.
Membrane/pProbe RF Probe cards provide best-in class RF performance and maintain exceptional signal integrity from the tester interface to the die for semiconductor wafer test. Capable of probing beyond 80 GHz, Membrane/pProbe probes provide the highest fidelity measurements for RF applications. Pyramid is capable of both high-volume manufacturing and engineering applications due to its minimal pad damage and low probe inductance. Membrane/pProbe probes have the lowest ground inductance available in a probe card allowing for optimized RF measurements of any RF application from cell phone RF Front End parts to Automotive Radar chips.
▶ 3D MEMS is the exclusive partner of FormFactor Inc. in China.
3D MEMS technology serves as the key to crafting probes with micron-level precision, establishing contact with I/Os and power connections on ICs. 3D MEMS probes as ideal for supporting the intricate demands of fine-pitch and high-pin count requirements in leading-edge semiconductor process nodes and advanced packaging.
The QiLin product is designed for Wafer Level Chip Scale Packaging(WLCSP) applications with bump pitch range above 200um. QiLin probe card offers superior planarity control and stability in production environment. To ensure uniform contact pressure on the solder bumps or pads during test. Tips styles can also be designed for specific applications to optimize contact surface area while minimizing contact wear factors, as well as lead and solder ball deformation. Elements can be scales and materials chosen to produce a contact that optimizes performance for high speed signals, or for high or low power requirements.
Designed for fine-pitch Flip-chip applications with high current carrying capability. Cobra probe cards are suitable for area-array and perimeter-layout probing applications, including both flip chip(Solder bumps, Cu Pillar and micro bumps) and pre-bump or bonding pad application. It is the industry-leading flip chip probe card of choice for graphics processors, game console microprocessors, and automotive microcontrollers. Leveraging proprietary manufacturing technology, it delivers excellent reliability and quality for parallel DUT testing, and technology scalability to address a broad range of testing requirements.
The cantilever probe card is mainly used for testing logic chips with small pitch and wire-bonded packages. It can support a minimum inline pad pitch of 40um and a 20/40um staggered pitch design. Its ultra-short cantilever design is well-suited for high-speed chip testing at 3 GHz @ -3 dB. The probe marks on the cantilever probe card are highly consistent, ensuring the reliability of package bonding wires.
We provide various sets for 150mm machines, including EPS150RF (- HR), EPS150mmW, EPS150THz, EPS150Coax, EPS150Coaxplus (- HR), EPS150Triax, EPS150Tesla, meeting demand while considering cost-effectiveness.
▶ 200mm Systems are the exclusive partner of Formfactor Inc. in China.
The modular design allows for the selection of the appropriate configuration based on current needs and prepares for future upgrades. It offers manual, semi-automatic, and fully automatic operating modes to meet testing requirements from the laboratory to the production line. The integrated design eliminates the need for an additional vibration isolation system, minimizing the equipment's footprint.
▶ 300mm probe station are the exclusive partner of FormFactor Inc. in China.
Provides precise probe alignment, temperature control, and signal transmission to ensure highly repeatable test results, suitable for demanding applications. The modular design allows users to configure and upgrade according to specific needs, enabling flexibility to handle different testing tasks. The equipment is rigorously tested for durability and reliability, maintaining stable performance over long-term use. Comprehensive technical support and services are offered to ensure that users' various needs are addressed and resolved promptly during operation.
We offer a variety of analytical probes to meet different testing needs. Our RF, mixed-signal, and DC probes are designed to tackle the numerous challenges of various testing environments, delivering durable, high-performance products that exceed customer expectations.
We provide custom high performance tester interface hardware to a broad range of semiconductor automated test equipment (ATE) and laboratory board customers, including many in the Fortune 500. We are structured to support complete turn-key ATE hardware solutions from the design to manufacturing, and parts assembly of general-purpose wafer and packaged IC test application PCBs.