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Probe Cards Probe Station Systems Analytical Probe ATE Board

Cantilever Probe Card

The cantilever probe card is mainly used for testing logic chips with small pitch and wire-bonded packages. It can support a minimum inline pad pitch of 40um and a 20/40um staggered pitch design. Its ultra-short cantilever design is well-suited for high-speed chip testing at 3 GHz @ -3 dB. The probe marks on the cantilever probe card are highly consistent, ensuring the reliability of package bonding wires.

Application field

MCU

Analog chip

Digital chip

Flash memory chip

Consulting

Related Products

Standard cantilever probe card

• Uniform scrub performance for improved wire bond reliability
• Supports inline 40um pad pitch, 20/40um staggered pitch design, within 3000 high pin count
• Highly cost-effective testing solution

Cobra Probe Card

Designed for fine-pitch Flip-chip applications with high current carrying capability. Cobra probe cards are suitable for area-array and perimeter-layout probing applications, including both flip chip(Solder bumps, Cu Pillar and micro bumps) and pre-bump or bonding pad application. It is the industry-leading flip chip probe card of choice for graphics processors, game console microprocessors, and automotive microcontrollers. Leveraging proprietary manufacturing technology, it delivers excellent reliability and quality for parallel DUT testing, and technology scalability to address a broad range of testing requirements.

Application field

CPU

GPU

MCU

APU

FPGA

Consulting

Related Products

WST Cobra Vertical Probe Card

• The best cost-effectiveness
• Within 3000 high pin count
• Scalability to 80um pad pitch
• Planarity spec is within ± 12.5um
• Maximum test frequency support to 50 -100 MHz

MLO/MLC Cobra Vertical Probe Card

• Up to 20K ultra-high pin count
• Scalability to 80um pad pitch
• Planarity spec is within ± 12.5um
• Maximum test frequency support to 16Gbps

Qilin Probe Card

The QiLin product is designed for Wafer Level Chip Scale Packaging(WLCSP) applications with bump pitch range above 200um. QiLin probe card offers superior planarity control and stability in production environment. To ensure uniform contact pressure on the solder bumps or pads during test. Tips styles can also be designed for specific applications to optimize contact surface area while minimizing contact wear factors, as well as lead and solder ball deformation. Elements can be scales and materials chosen to produce a contact that optimizes performance for high speed signals, or for high or low power requirements.

Application field

WLCSP

200um+ bump/pad test

Consulting

Related Products

Qilin Probe Card

• Broad range of spring pins options for targeted application, with 200um+ bump pitch
• Variety of tip materials for maximum lifetime
• Replaceable individual probes for easy maintenance

3D MEMS Probe Card

▶ 3D MEMS is the exclusive partner of FormFactor Inc. in China.
3D MEMS technology serves as the key to crafting probes with micron-level precision, establishing contact with I/Os and power connections on ICs. 3D MEMS probes as ideal for supporting the intricate demands of fine-pitch and high-pin count requirements in leading-edge semiconductor process nodes and advanced packaging.

Application field

SOC

FLASH

SRAM

DRAM

Consulting

Related Products

Takumi Probe Card

• Support 30umx30um pad size, allowing room to produce more die per wafer
• Superior CRes performance for reliable parametric measurements
• Proprietary 3D MEMS MicroSpring contact for >1 million TDs touchdown lifetime

Hikari Probe Card

• Optimized array configuration with parallelism for fewer touchdowns--industry’s first x32 and x64 arrays in production
• Small scrub mark over wide temperature range for reduced particles
• Up to 5 Gbps, at high parallelism
• Customized lens module, split pixel option, diffuser option
• Passive components very close to device

HFTAP Probe Card

• K40 (up to 4.0 GHz/8.0 Gbps)high-speed test capable at memory wafer level test
• Supports LPDDR4X, DDR5, LPDDR5, HBM3, HBM3E, GDDR5 and GDDR6 and ect. product speed testing
• wide temperature range (-40°C to +125°C)
• ﬂexible pad layout with superior contact performance and delivers long probe card lifetime
• Excellent current-carrying capacity
• Fine pitch capability down to 50 μm Able to probe on very small pads

Smart Matrix/Touch Matrix Probe Card

• In the field of 12 inch memory wafer testing, it has outstanding advantages and can achieve full wafer testing with one contact, maximizing cost savings
• Higher parallelism, higher test efficiency, and lower cost of test by using Advanced TRE technology (ATRE)
• Terminated TRE (TTRE) to improve signal fidelity without the need to enhance ATE tester capability
• Robust 3D MEMS spring with superior tip position and scrub performance
• Superior thermal performance and design flexibility, excellent production uptime, ease of use and serviceability

TrueScale Probe Card

• 3D MEMS MicroSpring contact design with 200k high pin count and small pad size capability
• Capable of quickly completing product settings and improving probe card utilization and testing output within a wide temperature range of -40℃-150℃
• Scalability to 50 um pad pitch
• Improved planarization control for superior planarity

Membrane/pProbe Probe Card

▶Membrane/pProbe is the exclusive partner of FormFactor Inc. in China.
Membrane/pProbe RF Probe cards provide best-in class RF performance and maintain exceptional signal integrity from the tester interface to the die for semiconductor wafer test. Capable of probing beyond 80 GHz, Membrane/pProbe probes provide the highest fidelity measurements for RF applications. Pyramid is capable of both high-volume manufacturing and engineering applications due to its minimal pad damage and low probe inductance. Membrane/pProbe probes have the lowest ground inductance available in a probe card allowing for optimized RF measurements of any RF application from cell phone RF Front End parts to Automotive Radar chips.

Application field

Filter

TIA

Auto Radar

MMW

Consulting

Ralated Products

Membrane/pProbe Probe Card

• High-bandwidth RF microstrip transmission lines to probe tips guarantee performance and ensure low signal loss.
• Patented ground and power planes, with bypass capacitors, provide resonance-free stable power supplies directly to the DUTs.
• Consistent low contact resistance and low-inductance probe tips ensure accurate and repeatable RF measurements.

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